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| ALD (Atomic Layer Deposition) | A thin film deposition technique that is based on the sequential use of a gas phase chemical process |
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| By-Product | A secondary product derived from a manufacturing process or chemical reaction |
| CCP (Capacitively Coupled Plasma) | One of the most common types of industrial plasma sources. It essentially consists of two metal electrodes separated by a small distance, placed in a reactor. |
| Chiller | A machine that removes heat from a liquid via a vapor-compression or absorption refrigeration cycle |
| CMP (Chemical Mechanical Polishing) | A process of smoothing surfaces with the combination of chemical and mechanical forces |
| Conduction | The transfer of internal energy by microscopic diffusion and collisions of particles or quasi-particles within a body |
| CVD (Chemical Vapor Deposition) | A chemical process used to produce high quality, high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. |
| Diffusion | The net movement of a substance (e.g., an atom, ion or molecule) from a region of high concentration to a region of low concentration |
| Etching | Process which is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing |
| Mantle Heater (Heating Jacket) | Device which controls either the temperature of the process or the temperature of the part |
| High-k dielectric | Term which refers to a material with a high dielectric constant κ (as compared to silicon dioxide). High-κ dielectrics are used in semiconductor manufacturing processes where they are usually used to replace a silicon dioxide gate dielectric or another dielectric layer of a device. |
| ICP (Inductively Coupled Plasma) | A type of plasma source in which the energy is supplied by electric currents which are produced by electromagnetic induction, that is, by time-varying magnetic fields |
| Ion Implantion | A materials engineering process by which ions of a material are accelerated in an electrical field and impacted into a solid. This process is used to change the physical, chemical, or electrical properties of the solid. |
| Leak | A way (usually an opening) for fluid to escape a container or fluid-containing system, such as a tank or a ship's hull, through which the contents of the container can escape or outside matter can enter the container |
| LED (Light Emitting Diode) | A two-lead semiconductor light source. It is a pn-junction diode, which emits light when activated. |
| Photomask | An opaque plate with holes or transparencies that allow light to shine through in a defined pattern. They are commonly used in photolithography |
| MOCVD | Deposition method which was known as organometallic vapour phase epitaxy (OMVPE) or metalorganic chemical vapour deposition (MOCVD), is a chemical vapour deposition method used to produce single or polycrystalline thin films. |
| OLED (Organic Light Emitting Diode) | A light-emitting diode (LED) in which the emissive electroluminescent layer is a film of organic compound which emits light in response to an electric current |
| Oxide Film (oxide layer) | Layer which insulates structure that penetrates under the surface of the wafer, so that the Si-SiO2 interface occurs at a lower point than the rest of the silicon surface |
| Packaging | The technology of enclosing or protecting products for distribution, storage, sale, and use. Packaging also refers to the process of design, evaluation, and production of packages. |
| PECVD | A process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved in the process, which occur after creation of a plasma of the reacting gases. |
| Photolithography | Term of optical lithography or UV lithography, is a process used in microfabrication to pattern parts of a thin film or the bulk of a substrate. It uses light to transfer a geometric pattern from a photomask to a light-sensitive chemical "photoresist", or simply "resist," on the substrate. |
| Plasma | One of the four fundamental states of matter, the others being solid, liquid, and gas. A plasma has properties unlike those of the other states. |
| PM (Preventive Maintenance) | The care and servicing by personnel for the purpose of maintaining equipment and facilities in satisfactory operating condition by providing for systematic inspection, detection, and correction of incipient failures either before they occur or before they develop into major defects. |
| Scrubber | A diverse group of air pollution control devices that can be used to remove some particulates and/or gases from industrial exhaust streams |
| Semiconductor | An electrical conductivity value falling between that of a conductor, such as copper, and an insulator, such as glass. Semiconductors are the foundation of modern electronics. |
| Solar cell | An electrical device that converts the energy of light directly into electricity by the photovoltaic effect. It is a form of photoelectric cell, defined as a device whose electrical characteristics, such as current, voltage, or resistance, vary when exposed to light. Solar cells are the building blocks of photovoltaic modules, otherwise known as solar panels. |
| Trap | A device for trapping reaction by-product is exhausted to pump in the process chamber. Prevent to blocking phenomena of exhaust line and ensure to convenience and durability of the equipment operation as minimizing the Pump Down. |
| Vacuum | Space that is devoid of matter. The word stems from the Latin adjective vacuus for "vacant" or "void". An approximation to such vacuum is a region with a gaseous pressure much less than atmospheric pressure. |
| Vacuum Pump | A device that removes gas molecules from a sealed volume in order to leave behind a partial vacuum |
| Wafer | A slice or substrate, is a thin slice of semiconductor material, such as a crystalline silicon, used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells. |
